- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Patent holdings for IPC class H01L 21/687
Total number of patents in this class: 6318
10-year publication summary
320
|
411
|
571
|
724
|
751
|
745
|
719
|
745
|
689
|
224
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Applied Materials, Inc. | 16587 |
1064 |
Tokyo Electron Limited | 11599 |
645 |
Lam Research Corporation | 4775 |
407 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
279 |
Screen Holdings Co., Ltd. | 2431 |
276 |
Semes Co., Ltd. | 1119 |
170 |
Samsung Electronics Co., Ltd. | 131630 |
143 |
ASML Netherlands B.V. | 6816 |
126 |
ASM IP Holding B.V. | 1715 |
110 |
Ebara Corporation | 1951 |
107 |
Kokusai Electric Corporation | 1791 |
77 |
Disco Corporation | 1745 |
70 |
LAM Research AG | 188 |
68 |
Brooks Automation US, LLC | 348 |
59 |
Kawasaki Heavy Industries, Limited | 1524 |
52 |
NGK Insulators, Ltd. | 4589 |
51 |
Varian Semiconductor Equipment Associates, Inc. | 1282 |
48 |
Beijing Naura Microelectronics Equipment Co., Ltd. | 430 |
44 |
EV Group E. Thallner GmbH | 376 |
40 |
Kioxia Corporation | 9847 |
40 |
Other owners | 2442 |